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Creators/Authors contains: "Hwang, James_C_M"

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  1. The high-power performance of a D-band (110–170 GHz) traveling wave amplifier (TWA) is reported. The amplifier was designed and fabricated using a GaN-on-SiC high-electron mobility transistor (HEMT) technology integrated with a substrate integrated waveguide (SIW) structure for low-loss on-chip power combining. Active injection load-pull measurements of both discrete HEMTs as well as the completed MMIC TWA were performed. The discrete HEMT measurements at D-band supplement the available design data for these scaled GaN HEMTs. The TWA achieved a peak power-added efficiency (PAE) of 9.1% at 145 GHz. The available output power exceeded 23.5 dBm from 135-145 GHz, with a maximum output power of 24.7 dBm (295 mW) at 140 GHz. Keywords—millimeter 
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    Free, publicly-accessible full text available September 21, 2026
  2. Free, publicly-accessible full text available July 9, 2026
  3. Aluminum nitride (AlN) offers novel potential for electronic integration and performance benefits for high‐power, millimeter‐wave amplification. Herein, load‐pull power performance at 30 and 94 GHz for AlN/GaN/AlN high‐electron‐mobility transistors (HEMTs) on silicon carbide (SiC) is reported. When tuned for peak power‐added efficiency (PAE), the reported AlN/GaN/AlN HEMT shows PAE of 25% and 15%, with associated output power () of 2.5 and 1.7 W mm−1, at 30 and 94 GHz, respectively. At 94 GHz, the maximum generated is 2.2 W mm−1, with associated PAE of 13%. 
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